The three chip entries and their shared qualifier Annex III Class I (13)-(15), Art. 7(1)
Annex III Class I lists three silicon categories in a row: microprocessors with security-related functionalities (item 13), microcontrollers with security-related functionalities (item 14), and ASICs and FPGAs with security-related functionalities (item 15). The phrase "with security-related functionalities" is doing the classifying work in all three.
That qualifier is the pivot. A processor or microcontroller that carries out security functions, such as key storage, cryptographic acceleration, secure boot, or a hardware root of trust, falls in the category. A plain compute part without such functionality does not, and stays a default-category product with the ordinary free choice of conformity route.
Where the technical descriptions do the deciding Art. 7(4)
The Commission fixed the technical description of each category in an implementing act under Article 7(4) (Implementing Regulation (EU) 2025/2392). Because "security-related functionalities" has no self-evident boundary, that description, not the datasheet marketing, decides whether a given part is in items 13 to 15.
This matters most for parts that blur the line, such as a general-purpose microcontroller with an optional crypto peripheral, or an FPGA sold for mixed workloads. Resolve those against the implementing regulation and document the reasoning; a wrong call changes your conformity route, not just your paperwork.
Judgment call: The CRA text does not define how much security capability makes a chip "security-related"; the technical descriptions control, and borderline parts deserve a documented classification.
Class I here, Class II for tamper-resistant parts Annex III Class II (3)-(4), Art. 32(2), Annex VIII
The security-chip entries in Class I are distinct from the tamper-resistant microprocessors and microcontrollers listed separately in Class II (items 3 and 4). A part designed to resist physical tampering and extraction is treated as a higher-tier product with a stricter route, so confirm which tier your part sits in before choosing a procedure.
For a Class I security chip, internal control (module A) stays available only where you apply harmonised standards, common specifications, or a European cybersecurity certification scheme at assurance level at least "substantial" in full. Otherwise the route is EU-type examination plus conformity to type (modules B and C) or full quality assurance (module H) via a notified body.
The rest of the manufacturer programme still applies Art. 13, Art. 14, Annex I
Whichever tier applies, the substance of the duties is the same: essential cybersecurity requirements, vulnerability handling including a coordinated vulnerability disclosure policy, technical documentation, CE marking, and reporting of actively exploited vulnerabilities and severe incidents. Silicon vendors should also plan for the information duties toward integrators.